Tin removing
detail
Tin removing
Characteristics of a product
The X-03 tin removing a single liquid nitric peroxide, fluorine-free and complexing agents retire tin / lead solution, you can step back in addition to the copper surface of tin or pewter, and copper-tin alloy layer. Stripping stripping of tin / tin-lead alloy layer for the copper surface, but also applies to the electronic components (ICs), printed circuit board (PCB) manufacturing copper surface of the tin / tin-lead alloy layer, available soaking or mechanical spray leaching method of operation. The appearance of yellow transparent liquid.
1 Retreat tin / tin-lead speed, large capacity tin. Retreat of tin / tin-lead copper surface clean and bright, no sediment. Minimal corrosion on copper surface, the grass-roots resin will not corrode.
2 Does not contain fluoride, peroxide, smoke-free, basically odorless, environmentally friendly processing simple.
3. Tin speed retreat: soak for 10 to 15 seconds can retire tin coating 6UM, the handling capacity of 2.5 - 3.4 m2 / l; copper corrosion rate of 0.3-0.8um / min (≤ 35 ° C); Operating temperature :15-40 ℃ (not higher than 40 ° C, the optimum temperature of 25-35 ° C)
Two slotted parameter
X-02: dope use
Time: 10 ~ 15 seconds (retreat tin coating 4-6um)
Three bath process control management
1 Slotting: It is recommended to use 20% -30% of the old fluid merge opening cylinder.
2 Between the control solution temperature of 20-40 ° C, if the temperature exceeds 40 ° C must use the cooling system or suspended.
3. According to the tin layer thickness and clean, withdrawal pewter liquid Condition, and adjust the operating time.
4. Back tin time to 90 seconds to retreat without a net, pour 30-40% of old fluid, add back the tin water to normal level.
5 When Step 4 is still less than the desired effect, or refund the proportion of tin liquid 1.136-1.38, need to re-open cylinder.
Four product packaging 25kg / barrel